Detail Description
Base material: FR4, Aluminum,Ceramics,Rogers,F4B,F4BK,F4BT,TP,TF,FR1, FR2, CEM-1, CEM-3,etc
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm ...
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